핫멜트 접착제의 경화에 영향을 미치는 요인

1. 경화 온도는 경화 과정에서 중요한 매개 변수 중 하나입니다.점착제. If the curing temperature is too high, it is easy to cause loss of the 점착제 or embrittlement of the 점착제 layer, resulting in a decrease in bonding strength. If the curing temperature is too low, the matrix molecular chain will be hard, and the crosslinking density of the hot melt glue stick 점착제 layer will be too low, and the curing reaction will not be completed. Therefore, during the curing process, the curing temperature must be strictly controlled. There is a specific curing temperature.

 

2. The curing time refers to the time required for curing during the bonding process under certain temperature and pressure conditions. The curing time of different 점착제s is also different, such as instant curing, there are a-cyanoacrylate 점착제s, hot melt 점착제s have a few hours to cure, such as room temperature fast curing epoxy 점착제s, second-generation acrylate 점착제s, there are several Stupid curing time, such as epoxy polyamide glue. The curing time is also affected by the curing temperature and pressure. Advancing the curing temperature can shorten the curing time. Under lower curing temperature conditions, the curing time should be greatly delayed. If it is lower than room temperature, sometimes it will not cure for a few days.

 

3. Curing pressure refers to applying a certain pressure during the curing process, which is conducive to good adhesion between the glue layer and the adherend and guarantees the quality. Due to the different types of hot melt glue sticks, the pressure applied is also different. The contact pressure is divided into three situations: the contact pressure is cured by the pressure generated by the weight of the adherend, without applying pressure, such as epoxy resin glue, a-cyanoacrylate glue, second-generation acrylate glue, unsaturated poly Ester glue, polyurethane glue, etc. 0.1~0.3 MPa pressure is used for solvent-based 점착제s, such as phenolic-acetal, phenolic-nitrile, epoxy-nitrile, epoxy-nylon, polyimide, etc. 0.3~0.5 MPa pressure is used for various 점착제s and hot melt 점착제s in film, powder, tube and granular form. The policy to increase stress is to increase its humidity.